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Semicon Taiwan 2009
September 30 -October 2, 2009, Taipei World Trade Center, Taiwan

Semicon Europa 2009
October 6-8, 2009, Messe Dresden Germany

PV Taiwan 2009
October 7-9 2009

Semicon Japan 2009
December 2 December 4, 2009, Makuhari Messe, Chiba, Japan

Semicon Russia 2010
June 14 -16, 2010, World Trade Center, Moscow, Russia

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  • Semiconductor Industry - Overview

  • History of Semiconductors, Industry Organizations, Conferences, Manufacturing of Solid State Devices, Semiconductor News, The Diode, The Transistor

  • Semiconductor Materials

  • Atomic Structure, The Periodic Table, Conferences on Semiconductor Materials, Electrical Conduction, Carrier Mobility, Conductors, Dielectrics, Doped Semiconductors, Electron and hole conduction, Intrinsic Semiconductors, Semiconductor Production Materials, Compound Semiconducting Materials, Germanium, Silicon

  • Crystal Growth and Wafer Preparation

  • Crystal Growing, Czochralski (CZ) Method, Float-zone Method, Crystalline Materials, Electronic Grade Silicon, Semiconductor Crystal Structure, Crystal Structure Applets and Viewer, Dislocations, Point Defects, Semiconductor Wafers, Silicon Shaping, Wafer Preparation

  • Contamination Control

  • Cleanroom, Contaminants - Chemicals, Metallic Ions, Particles, Contamination Control Companies, Contamination Control Organizations, Contamination Control Products - Buyers Guides, Magazines on Cleanrooms

  • Wafer Fabrication - Overview

  • Basic operations of wafer fabrication, Doping, Heat treatments, Layering, Patterning, Chip Design, Packaging, Regions of a wafer surface, Edge Die, Microchip, Scribe Lines, Wafer Flat, Wafer Sort

  • Process Yields

  • Conferences on Yield and Reliability, Defect and Yield Analysis, Analyzing Semiconductor Failure, Improving yield, Understanding Soft and Firm Errors in Semiconductor Devices, Using bitmap analysis to help identify yield-critical issues in the fab, VLSI chip yield demonstration, Yield Forecasting

  • Epitaxy

  • Conferences on Epitaxy, Fundamentals of Epitaxial Deposition, The Grove Epitaxial Model, Molecular Beam Epitaxy, Silicon on Insulators, Quantum Devices, SOI Wafer Manufacturer, Vapor-Phase Epitaxy

  • Oxidation

  • Field Oxide, Gate Oxide, Oxidation Kinetics, Properties of Oxide, Silicon Oxidation Procedure, Thermal Oxidation, Thermal Silicon Oxide Growth Time Calculator

  • Lithography

  • Lithography Equipment Manufacturer, Photoresist, 10 Process Steps for Photolithography explained together with a short movie, Electron Beam Lithography (EBL), Immersion lithography, Optical Lithography, Semiconductor Tour Photolithography Process

  • Reactive Plasma Etching

  • Dry Etch Equipment Manufacturers, Etching and Pattern Transfer, Etching Overview (Wet and Reactive Ion Etching), Plasma Etch, Plasma-etching processes for ULSI semiconductor circuits

  • Film Deposition

  • Chemical Vapor Deposition (CVD), Electrochemical Deposition, Physical Vapor Deposition (PVD)

  • Ion Implantation

  • Ion Implantation Services, An Introduction to Plasma Source Ion Implantation, Ion Implantation Profile Calculator, Concentrations of Arsenic, Boron, and Phosphorous ions at various substrates, Resistivity & Mobility Calculator for various doping concentrations in silicon, Semiconductors Silicon Device Fabrication Doping (Junction Formation), The Ion Implanter

  • Metallization

  • Metal-Semiconductor Junctions, Metal-Semiconductor Ohmic & Schottky Contacts - Barrier Height and Depletion Width Calculators, Multi Layer Metalliization, Properties of Metallizations Used in Semiconductor Manufacturing, Semiconductor Tour Interconnect - Metallization, Semiconductors Silicon Metallization Alloying and Annealing, Semiconductors Silicon Metallization Backlapping and Backside Metallization

  • Wafer Test and Evaluation

  • Testability and Test Structures, What is Surface Analysis

  • Assembly and Packaging

  • Ball Grid Arrays (BGA), Chip on Board (COB), Chip Scale Package (CSP), Conferences on Device Packaging, Die Bonding, Flip Chip Assembly, Magazines on Packaging, Multi Chip Modules (MCM), Packaging and Bonding Equipment Manufacturers, Packaging Foundries

  • Appendix

  • Semiconductor Abbreviations,,Semiconductor Companies, IC Manufacturers, A D Converters, ASICs, Chip Sets, Controller, CPLDs (Complex Programmable Logic Devices), D A Converter, Data Compression ICs, DC DC Converters, DRAM, DSPs (Digital Signal Processors), EPROM, FLASH Memory, FPGAs (Field Programmable Gate Arrays, Microcontroller, Microprocessor, Network Processors, SRAM, Transceiver, Semiconductor Equipment Manufacturers, Semiconductor Engineering Websites, Semiconductor Glossaries, Dictionaries, Semiconductor related Magazines, Semiconductor Terms, Sourcing and procurement of electronic components, Chip Directories, Product Datasheets, Semiconductor Distributors

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